All products

K4B4G1646E-BYMA 4Gb DDR3L SDRAM | 933MHz | 96-FBGA Package | Samsung

The K4B4G1646E-BYMA is a 4Gb (512MB) DDR3L SDRAM from Samsung, organized as 256M x 16 and supporting clock frequencies up to 933MHz (1866MT/s data rate). Housed in a 96-ball FBGA package (7.5x13.3mm), it operates at a low voltage of 1.35V (backward compatible with 1.5V) and across a temperature range of 0°C to 95°C. Built on Samsung's mature process technology, this device supports advanced features including auto precharge, ZQ calibration, and dynamic on-die termination (ODT). It is ideally suited for industrial controls, consumer electronics, communication equipment, and other applications requiring cost-effective memory solutions. We supply 100% original, new products with ample stock, fast delivery, and professional technical support.

Stock Count: 10080

Price:$TBD

KLM8G1GEME-B041 8GB eMMC 5.1 | HS400 Interface | 153-FBGA Package | Samsung

The KLM8G1GEME-B041 is an 8GB eMMC 5.1 embedded storage chip from Samsung, integrating MLC NAND flash and a dedicated controller in a 153-ball FBGA package (11.5×13×0.8mm). It supports the HS400 high-speed interface, delivering sequential read speeds up to 330MB/s. This device is ideal for smartphones, smart TVs, game consoles, and embedded systems requiring reliable, cost-effective storage. The built-in controller handles bad block management, ECC error correction, and wear leveling, simplifying host processor design. We supply 100% original products with fast delivery and technical support.

Stock Count: 1100

Price:$TBD

KLMCG2UCTB-B041 64GB eMMC 5.1 | HS400 Interface | 153-FBGA Package | Samsung

The KLMCG2UCTB-B041 is a high-performance eMMC 5.1 embedded storage chip from Samsung, integrating NAND flash and a controller in a 153-ball FBGA package (11.5x13x0.8mm). It offers 64GB of storage capacity, supports the HS400 high-speed interface, and delivers sequential read speeds up to 330MB/s and sequential write speeds up to 200MB/s, with random read/write performance reaching 11,000 IOPS and 13,000 IOPS respectively. The device supports 1.8V/3.3V dual-voltage operation across a temperature range of -25°C to +85°C, and features a command queue function and secure write protection protocol. It is ideally suited for smartphones, tablets, ultra-slim mobile devices, embedded systems, and other applications requiring high-cost-performance, large-capacity storage. We supply 100% original, new products with ample stock, fast delivery, and professional technical support.

Stock Count: 20000

Price:$TBD

KLM8G1GETF-B041 8GB eMMC Flash | eMMC 5.1 | 330MB/s Read | FBGA-153 Package | Samsung

The KLM8G1GETF-B041 is an 8GB eMMC embedded Flash memory from Samsung, compliant with the eMMC 5.1 interface protocol and utilizing MLC NAND technology. It integrates NAND Flash and controller into a single device, communicating with the host via a standard 8-bit parallel interface and supporting HS400 high-speed mode. Housed in a 153-FBGA package (11.5x13mm), it supports dual-voltage operation with VCC 2.7V to 3.6V and VCCQ 1.7V to 1.95V or 2.7V to 3.6V, across a temperature range of -25°C to +85°C. It offers sequential read speeds up to 330MB/s and write speeds up to 50MB/s, and features built-in bad block management, wear leveling, and ECC error correction. This device is ideally suited for industrial controls, embedded systems, smart terminals, and other applications requiring high-reliability embedded storage. We supply 100% original, new products with fast delivery and professional technical support.

Stock Count: 8960

Price:$TBD